Vi TECHNOLOGY 3D SPI SOLDER PASTE INSPECTION (AOI)


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Manufacturer: Vi TECHNOLOGY More in the category of Vi TECHNOLOGY 3D SPI SOLDER PASTE INSPECTION (AOI)
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Model: 3D SPI
Type: SOLDER PASTE INSPECTION (AOI)
Year: 04/2008
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Vi Technology 3D SPI In-line Solder Paste Inspection (AOI) System

  • Model: 3D XPI 4000L
  • Vintage: 04/2008
  • Voltage 220
  • FAHP (Flying Absolute Height Profilometry) Measurement method
  • Dual Light Source and On-the-fly Image scan
  • High power M/H light 3D Sensor
  • Shadow free inspection based
  • High-speed linear motors with closed loop high resolution linear encoders
  • Automatic conveyor width adjustment for boards up to 510 mm x 460 mm [20" x 18"]
  • Height Accuracy on certification plate: < 3 μm
  • Height Repeatability on certification plate: <1.5 μm at 3 Sigma
  • Volume Repeatability on certification plate: <2% at 3 Sigma
  • Gage R&R: <10%
  • Inspection time: 20 cm²/s (without shadow effect)
  • Operating System: Windows XP Professional
  • Monitor: 17" LCD

Please click on the link below of the 3D SPI in operation.

http://youtu.be/fEpAhmHtCps


  
  
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