Key Benefits:
• Lead-Free and thermally challenging assemblies
• Minimal Copper dissolution in PCB barrels
• Minimal board delamination
• Fast and uniform heating
• Precise operating controls and alignment system
• Quick component removal and soldering
• Product reliability, simple design, trouble-free operation

Specifications:
• Physical Dimensions: 32”W x 32”D x 26”H
• Solder Capacity: 35 lbs. Weight with Solder: 125 lbs.
• Compressed Air: 40-80 psi, clean moisture free
• Electrical: 208/220V, 15 amps @ 220V, 50/60Hz
single phase, 2500 watts.

Features/Benefits:
Precise Operating Control
• Solder Wave Contact:
Cycle duration automatically sets time solder contacts board.
• Solder Wave Flow Rate:
Allows level wave for any flow well shape or size. Three (3) stage settings for enhanced process control.
• Temperature:
Closed-loop control of set temperature. System can be set to 615°F (325°C).

Pumping System & Solder Pot
• Cast iron solder pot and titanium/cast iron impeller pump
are designed to withstand aggressive, lead-free solder.
• Minimal dross accumulation and level solder wave.

Alignment System
• X, Y, Z Board Carrier - Cantilever rails, linear bearings
and rigid cast framework provides large board holding,
precision rail movement and continuous usage.
• PCB Hole Cleaning System (option) - Component is
aligned over solder wave then cleaning hood is
positioned to clean PCB barrels.

Titanium Flow Wells
• Solder flow is directed away from adjacent components.
• High pin count leads are heated simultaneously for a
quick process.
• Locating pins position the lead pattern over the wave.
• External heaters maintain uniform heat on large wells.
• Fixtures for multiple and irregularly shaped boards.