96.5% Tin / 3.5% Silver & 96% Tin / 4% Silver

DESCRIPTION

Tin/Silver Alloys are compatible with most major electronic grade fluxes on the market today, and are available in paste and wire form in no-clean, water soluble and rosin chemistries.                                                                                                                

FEATURES 

• Excellent resistance
• Excellent solder joint reliability
• High Purity
• Compatible with most flux types
• Mfg. to J-Std-006

 

TEMPERATURE REQUIREMENTS

APPLICATION	RECOMMENDED TEMPERATURE
REFLOW SOLDERING	PEAK TEMPERATURE 240 – 250 C (464 – 482 F)
WAVE SOLDERING	POT TEMPERATURE OF 260 C (500 F)
HAND SOLDERING	TIP TEMPERATURE OF 355 – 410C (700 – 800F)